low profile (metal alloy) inductors ? l301212hf series proprietary and confidential document of superworld 27/07/2016 p1 1. part no. expression: l 3 0 1 2 1 2 h f 1 r 0 m (a) (b) (c) (d) (e) (a) series code (d) inductance code (b) dimension code (e) tolerance code (c) material code 2. configuration & dimensions: unit: mm a b c d e g h l 3.500.20 3.200.20 1.20 max. 0.300.20 1.200. 20 1.90 1.45 4.10 3. schematic: l g h recommended pc board pattern note: 1. the above pcb layout is for reference only.. 2. marking: inductance code
low profile (metal alloy) inductors ? l301212hf series proprietary and confidential document of superworld 27/07/2016 p2 4. materials: 5. general specification: 6. electrical characteristics: part number inductance (uh)20% dcr(m ? ) i sat (a) irms (a) max. typ. max. typ. max. typ. l301212hfr47m 0.47 30 25 5.80 7.20 4.00 5.00 l301212hf2r2m 2.20 106 85 2.80 3.40 2.40 3.00 l301212hf4r7m 4.70 212 170 2.30 2.80 1.30 1.60 L301212HF100M 10.00 420 338 1.20 1.50 0.80 1.00 notes: at all times, the current supplied to the product should not exceed isat max. value. (a) alloy body (b) copper wire (c) terminal (d) ink (a) test freq. : l : 100khz/1v (b) operating temp. : -40c to +125c (inclusive of coil temp rise) (c) storage temp. : -40c to +125c (on board) (d) humidity ra nge : 852% rh (e) heat rated current (irms) will cause the coil temperature rise ? t of max. 40c (keep 1min) (f) saturation current (isat) will cause ? l/ l0a to drop Q 30%. (g) part temperature (ambient+temp. ris e) : should not exceed 125c under worst case operating conditions. (h) storage condition (component in its packaging) i) temperature: less than 40c ii) humidity : 60% rh
low profile (metal alloy) inductors ? l301212hf series proprietary and confidential document of superworld 27/07/2016 p3 7. characteristic curves:
low profile (metal alloy) inductors ? l301212hf series proprietary and confidential document of superworld 27/07/2016 p4 8. soldering: mildly activated rosin fluxes are preferred. the mi nimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. our terminations are suitable for all re-flow solderi ng systems. if hand solderin g cannot be avoided, the preferred technique is the utiliza tion of hot air soldering tools. note: -if wave soldering is used , there will be some risk. -reflow soldering temperatures below 240c, there will be non-wetting risk. 8-1: solder re-flow: recommended temperature profiles for re-flow soldering in figure 1 8-2: soldering iron (figure 2): products attachment with soldering iron is discour aged due to the inherent process control limitations. in the event that a soldering iron must be empl oyed the following precautions are recommended. note: a) preheat circuit and products to 150c b) 350c tip temperature (max.) c) never contact the ceramic with the iron tip d) 1.0mm tip diameter (max.) e) use a 20watt soldering iron with tip diameter of 1.0mm f) limit soldering time to 4-5 sec
low profile (metal alloy) inductors ? l301212hf series proprietary and confidential document of superworld 27/07/2016 p5 9. packaging information: 9-1 reel dimension 9-2 tape dimension 9-3 packaging quantity type a(mm) b(mm) c(mm) d(mm) 13?x12mm 12.4+2/-0 1002 13.50.5 330 l 301212 chip / reel 4000 inner box 8000 carton 32000 series size bo(mm) ao(mm) ko(mm) p(mm) w(mm) f(mm) t(mm) l 301212 3.80.1 3.50.1 1.50.1 8. 00.1 12.00.3 5.50.1 0.350.05
low profile (metal alloy) inductors ? l301212hf series proprietary and confidential document of superworld 27/07/2016 p6 9-4 tearing off force application notice: 1. storage conditions: to maintain the solderabililty of terminal electrodes: a) recommended products should be used wi thin 12 months from the time of delivery. b) the packaging material should be kept wh ere no chlorine or sulfur exists in the air. 2. transportation: a) products should be handled with care to avoi d damage or contamination from perspiration and skin oils. b) vacuum pick up is strongly recommended for individual components. c) bulk handling should ensure that abrasion and mechanical shock are minimized. the force for tearing off cover tape is 15 to 60 grams in the arrow direction under the following conditions. room temp. (c) room humidity (%) room atm (hpa) tearing speed mm/min 5~35 45~85 860~1060 300
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